1.Si Wafer

2”~12”, Single Side Polished & Double Side Polished, P-Type & N-Type, Resistivity: Low ( 1000 ohm-cm, FZ Process), Circular & Rectangular, Grade : Prime / Test / Dummy, Direction : , ,

2. Special Si Wafer :

With Thermal Oxides, SOI (Silicon On Insulation)

3. Glass Substrate :

Corning E2000 & XG Glass (25~300mm, 0.5~1.1mm Thick), Schott D263T, Pyrex,Other Optical Glass (BK7, …)

4. ITO Coated Glass :

< 15 ohm/cm², Transmittance > 85%, 1200A, 400x370x0.7mm

5. GaAs :

2”~4”, Semi-Conductiong / Semi-Insulating, N-Type & P-Type, EPD < 5000 (LED) & < 500 (LD)

6. Sapphire (Al₂O₃) :

2”~6”, C-Plane (for LED) & R-Plane (for HTS), Single Side Polished & Double Side Polished

7. Ge:

2”~4”, Semiconducting, N-Type, EPD < 500, 170~350um Thick

8. SiC :

2” & 3”, Conducting (0.1 ohm-cm) & Semi-Insulating (> 10⁵ ohm-cm), 4H & 6H, C-Plane

9. ZnO :

10x10mm, 20x20mm, 1”, C-Plane,  Undoped, (10-10) & (11-20), FWHM < 30”

10. LiNbO3 & LiTaO3 :

For SAW application, 2”~4”, X-Y-Z Cut

11. HTS Substrate :

LaAlO₃, SrTiO₃, MgO, Sapphire, MgO, LSAT, YSZ

12. Special Substrate :

GaP, InP, GaSb, InSb, InAs, Quartz (SiO₂), AlN, NaCl, MgF₂, CaF₂, ...